Modular spatially combined EHF power amplifier
US9362609B2 · kind B2 · utility
2Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2014 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Sep 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/036
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.