Circuit assembly and corresponding methods
US9363892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2013 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jun 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members (1301,1302,1303,1304) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.