Patent · US Active

Method for manufacturing an electronic module and an electronic module

US9363898B2 · kind B2 · utility

33Cited by

28References

14Claims

0Family size

Assignee

GE Embedded Electronics Oy · FI

Inventors

Risto Tuominen · Espoo, FI
Petteri Palm · Regensburg, DE
Antti Iihola · Helsinki, FI

Key dates

Filing date	Feb 17, 2015
Grant date	Jun 7, 2016
Priority date	—
Expiry date	Feb 17, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.