Patent · US Active

Method for forming an ultrasound transducer array

US9364863B2 · kind B2 · utility

0Cited by

4References

15Claims

0Family size

Assignee

Siemens Medical Solutions USA, Inc. · US

Inventors

Stefan Stegmeier · Munich, DE
Jörg Zapf · Munich, DE
Xuanming Lu · Issaquah, US

Key dates

Filing date	Jan 23, 2013
Grant date	Jun 14, 2016
Priority date	—
Expiry date	Feb 6, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10N39/00
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.