Method of machining a thin-walled structure
US9364930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Jan 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49998
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manipulating a thin-walled structure includes providing a thin-walled structure in a first unconstrained configuration, constraining the thin-walled structure to a first constrained configuration in which a first feature of the thin-walled structure is spatially located relative to the a second feature of the thin-walled structure in a predetermined manner, wherein an open volume of the thin-walled structure is constrained to maintain a predetermined open volume shape, and machining the thin-walled structure to a second constrained configuration in which the first feature of the thin-walled structure remains spatially located relative to the second feature of the thin-walled structure in the predetermined manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.