Micromachined on-wafer probes and related method

US9366697B2 · kind B2 · utility

Assignee

• University of Virginia Patent Foundation · US

Inventors

• Robert M. Weikle, II · Crozet, US
• Arthur Weston Lichtenberger · Charlottesville, US
• Nicolas Scott Barker · Charlottesville, US
• Theodore Reck · Oak Ridge, US
• Haiyong Xu · Charlottesville, US
• Lihan Chen · Charlottesville, US

Key dates

• Filing date: May 20, 2011
• Grant date: Jun 14, 2016
• Expiry date: Jun 2, 2032

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R3/00
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromachining process to fabricate a single chip that simple drops into a supporting structure. The micromachining process provides the ability to create a probe that will interface with integrated circuits, for example, operating at frequencies in the range of about 100 GHz to about 3,000 GHz (3 THz). This approach creates a silicon structure (or other applicable choice of material) that provides mechanical force for probing while supporting the transfer of the high frequency energy between a measurement system and the integrated circuit, individual device or material.