Patent · US Active

Sensor protection

US9366720B2 · kind B2 · utility

0Cited by

6References

17Claims

0Family size

Assignee

Sensirion AG · CH

Inventors

Markus Graf · Zürich, CH
Matthias Streiff · Zürich, CH
Werner Hunziker · Männedorf, CH
Christoph Schanz · Neuffen, DE

Key dates

Filing date	Jan 26, 2012
Grant date	Jun 14, 2016
Priority date	—
Expiry date	Sep 4, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/13
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.