Transponder inlay and device including such an inlay
US9367791B2 · kind B2 · utility
1Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2011 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Jul 19, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The inlay (10) for the manufacture of a device (12) comprising a base made up of a multilayer structure within which the inlay (10) is designed to be incorporated, the insert (10) comprising a microcircuit and an antenna connected to the microcircuit. The transponder assembly is combined into a microcircuit module (26) and the substrate includes a cavity (28) dimensioned to completely receive the module (26).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.