Method for manufacturing semiconductor chip
US9368406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2015 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Aug 4, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor chip includes forming a front-side groove in a front surface of a substrate; forming a back-side groove wider than the front-side groove by a rotating cutting member from the back surface of the substrate toward the front-side groove; attaching a holding member having an adhesive layer to the back surface of the substrate after forming the back-side groove; dry-washing the back surface before attaching the holding member to the back surface; extending the distance between adjacent semiconductor chips by expanding the holding member attached to the back surface; and separating the semiconductor chips at the extended distance therebetween from the holding member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.