Integrated circuit film and method of manufacturing the same
US9368427B2 · kind B2 · utility
1Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2013 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit film and a method of manufacturing the same are disclosed. The integrated circuit film includes a circuit board containing a circuit route; a first set of pads located on a first surface of the circuit board and configured to be applicable to ISO 7816 standard; and a semiconductor device mounted on the circuit board for communicating with at least one of the first set of pads. The first set of pads are arranged in two rows and the semiconductor device is mounted on the circuit board in a space between the two rows of pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.