Image sensor device and method of manufacturing the same
US9368538B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
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Key dates
| Filing date | Apr 21, 2015 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Apr 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13
Abstract
An image sensor device includes a top substrate and a subassembly. The top substrate includes a plurality of connection pillars, and the subassembly includes a plurality of connection pads. The connection pillars on the top substrate are bonded to the connection pads in the subassembly. The connection pillars are formed of a first metal and the connection pads are formed of a second metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.