3D pillar inductor
US9368564B2 · kind B2 · utility
5Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2014 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Mar 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Base pads are spaced by a pitch on a support surface. Conducting members, optionally Cu or other metal pillars, extend up from the base pads to top pads. A top pad interconnector connects the top pads in a configuration establishing an inductor current path between the base pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.