Circuit card assembly and method of manufacturing thereof
US9370090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2014 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Nov 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.