Patent · US Active

Wirebonding fixture and casting mold

US9370337B2 · kind B2 · utility

0Cited by
7References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 30, 2013
Grant dateJun 21, 2016
Priority date
Expiry dateJan 2, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4957
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.