Resin molding apparatus and resin molding method
US9370879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2012 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Jul 5, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A lens molding apparatus of the present invention includes: a mold having a transfer surface for transferring a predetermined lens shape to a dielectric resin; a mold having a transfer surface for transferring a predetermined lens shape to the dielectric resin; a support device moving the mold; a heating device heating the dielectric resin so as to form a resin molded product, the dielectric resin having been supplied on the transfer surface; a DC power source forming an electric field by application of direct-current voltage between the mold and the mold; and switches switching a direction of the electric field between a direction from the mold to the mold and a direction from the mold to the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.