Resin molding apparatus and resin molding method
US9370884B2 · kind B2 · utility
3Cited by
16References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 10, 2010 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Jan 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin molding apparatus includes a pair of metal molds respectively arranged so as to be insulated from the ground with insulating materials, and a molding portion including the pair of metal molds and to which a resin material is provided. At least one metal mold of the pair of metal molds is provided with electrodes at two points flanking the molding portion. A high frequency current generator capable of applying high frequency current having a frequency of about 10 kHz or more is connected to the two electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.