Stencil printer having stencil shuttle assembly
US9370925B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2015 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Mar 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A stencil printer includes an electronic substrate support configured to support an electronic substrate and move the electronic substrate between a lowered position and a raised position. The stencil printer further includes a stencil shuttle assembly configured to support a stencil and to move the stencil between a first position in which the stencil is positioned toward a front of the stencil printer and a second position in which the stencil is positioned toward a back of the stencil printer. The stencil printer further includes a print head configured to engage the stencil to dispense a material onto the substrate during a print stroke. The stencil printer further includes a drive assembly configured to move the print head to perform the print stroke and configured to selectively move the stencil shuttle frame between the first and second positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.