Curing compositions having low-free amounts of methylenedianiline
US9371409B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Oct 1, 2013 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Mar 14, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for preparing a curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.