High-resolution imaging and processing method and system for determining a geometric dimension of a part
US9372077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2013 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Oct 8, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-resolution imaging and processing method and system for determining a geometric dimension of a part is provided. The method includes directing at least one plane of collimated radiation at a surface of a supported part. Each of the planes is occluded by the part to create unobstructed first and second planar portions of the plane of radiation passing by and not blocked by the supported part and to cast a radiation shadow of the supported part. Each of the first and second planar portions has a width and contains an amount of radiation which is representative of a respective geometric dimension of the part to be determined. The method includes increasing the width and decreasing the intensity of the first and second planar portions imaged on first and second predetermined measuring areas, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.