Bond surface testing apparatus and method
US9372148B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2013 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Oct 24, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2013/0208
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bond surface testing apparatus and method are presented. The bond surface testing apparatus comprises a solution chamber; a plurality of solution containers located in the solution chamber; a plurality of microfluidic pipettes; and an information capture module. Each solution container in the plurality of solution containers includes a microfluidic pipette in the plurality of microfluidic pipettes. A number of the plurality of microfluidic pipettes has a non-circular cross-section. The information capture module is physically associated with the solution chamber and is configured to capture information relating to bonding surface properties of the bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.