Multilayer wiring type double-interface IC card antenna module
US9373071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2013 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Jun 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring type dual-interface IC card antenna module includes: an electrode diaphragm layer, including an antenna and an electrode diaphragm; a clamping base layer including eight first through hole points right below eight metal contacts on the electrode diaphragm; an RFID antenna layer including an RFID antenna, a connecting contact, a first chip attaching point and a second chip attaching point; an insulation layer including eight second through hole points located right below the eight first through hole points, a third through hole point located right below the connecting contact, a fourth through hole point located right below the first chip attaching point, and a fifth through hole point located right below the second chip attaching point; and a bridge layer connected with the second chip attaching point and the connecting contact in a bridging manner. The antenna module can achieve full-automatic production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.