Multilayer ceramic electronic part, board having the same mounted thereon, and manufacturing method thereof
US9373446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2014 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Aug 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic part may include: a ceramic body; an active layer including a plurality of first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; an upper cover layer formed on an upper portion of the active layer; a lower cover layer formed on a lower portion of the active layer and having a thickness thicker than that of the upper cover layer; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive layers extended from both end surfaces of the ceramic body onto upper and lower main surfaces thereof; and first and second insulation layers formed on the first and second conductive layers disposed on both end surfaces of the ceramic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.