Semiconductor device and method of manufacturing semiconductor device
US9373562B2 · kind B2 · utility
0Cited by
9References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2015 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Mar 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device provided herewith includes a semiconductor substrate; a brazing material bonded to the semiconductor substrate; a heat sink connected to the semiconductor substrate via the brazing material and a resin. The heat sink includes a protruding portion formed outside of a range in which the heatsink is connected to the semiconductor substrate via the brazing material. The protruding portion is making contact with the brazing material. The resin seals the semiconductor substrate, the brazing material and the protruding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.