Electronic device package and manufacturing method thereof
US9373803B2 · kind B2 · utility
1Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2014 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Aug 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.