Electrically assisted chemical-mechanical planarization (EACMP) system and method thereof
US9375821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2012 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Mar 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A novel polishing pad is described. The polishing pad includes a base plate, a main polishing body, a plurality of metal bottom portions, a positive electrode conductive wire and a negative electrode conductive wire. The main polishing body made from a non-conductive material and disposed on the base plate includes a plurality of cavities thereon. The metal bottom portions are disposed in the cavities with each of the cavities having one of the metal bottom portions therein. The positive electrode conductive wire electrically is connected to a positive electrode of a power supply. The negative electrode conductive wire electrically is connected to a negative electrode of the power supply. The positive electrode conductive wire and the negative electrode conductive wire alternatively pass through the base plate and connect to the metal bottom portions respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.