Patent · US Active

Hotmelt adhesives having an extended open time

US9375895B2 · kind B2 · utility

1Cited by

6References

16Claims

0Family size

Assignee

SIKA TECHNOLOGY AG · CH

Inventors

Kai Paschkowski · Jork, DE
Mathias Cordes · Hamburg, DE

Key dates

Filing date	Apr 28, 2009
Grant date	Jun 28, 2016
Priority date	—
Expiry date	Sep 30, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31663
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-α-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between −10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.