Thermal interface material handling for thermal control of an electronic component under test
US9377486B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2014 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Mar 28, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.