Touch panel module and manufacturing method thereof
US9377823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2013 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Oct 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch panel module includes an integrated panel and a casing. The integrated panel defines a transparent region and a non-transparent region around the transparent region. The integrated panel has a covering substrate, a decorating layer disposed on the inner surface of the covering substrate and arranged in the non-transparent region, a sensing electrode layer disposed on the inner surface of the covering substrate and arranged in the transparent region, a circuit layer disposed on the decorating layer and electrically connected to the sensing electrode layer, and a protective layer at least covering par of the decorating layer and part of the circuit layer. The casing is formed by injection molding, wherein one portion of the casing is arranged in the non-transparent region and formed on the protective layer, and another portion of the casing covers a circumferential lateral edge of the integrated panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.