Adjustable heat sink supporting multiple platforms and system configurations
US9377828B2 · kind B2 · utility
3Cited by
11References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2013 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Mar 27, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.