Method and apparatus for cleaning semiconductor substrates
US9378989B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 23, 2012 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Jun 21, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a method and apparatus for cleaning a substrate, in particular a semiconductor substrate such as a silicon wafer. The substrate is placed in a tank containing a cleaning liquid, at an angle with respect to acoustic waves produced in said liquid. The angle corresponds to the angle of transmission, i.e. the angle at which waves are not reflected off the substrate surface. A damping material is provided in the tank, arranged to absorb substantially all waves thus transmitted through the substrate. A significant improvement in terms of cleaning efficiency is obtained by the method of the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.