Holding device for holding a patterned wafer
US9378996B2 · kind B2 · utility
0Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2011 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Nov 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F2 which penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.