Patent · US Active

Heat transfer for electronic equipment

US9379039B2 · kind B2 · utility

8Cited by

10References

18Claims

0Family size

Assignee

Cisco Technology, Inc. · US

Inventors

Mandy Hin Lam · Fremont, US
Hong Huynh · Fremont, US
M. Baris Dogruoz · Campbell, US

Key dates

Filing date	Sep 4, 2013
Grant date	Jun 28, 2016
Priority date	—
Expiry date	Jun 6, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.