Multi chip modules for downhole equipment
US9379052B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Nov 1, 2012 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Jan 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly for use in a downhole module may include a multilayer ceramic assembly and an electronic component disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes a ceramic substrate, a nickel plating layer disposed on the ceramic substrate and a gold plating layer having a thickness of less than about 0.5 microns disposed on the nickel plating layer. A wirebond such as an aluminum wirebond extends between the electronic component and the gold plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.