Composite reconstituted wafer structures
US9379174B2 · kind B2 · utility
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3References
9Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 25, 2014 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Jul 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reconstituted electronic device comprising at least one die and at least one passive component. A functional material is incorporated in the substrate of the device to modify the electrical behavior of the passive component. The passive component may be formed in redistribution layers of the device. Composite functional materials may be used in the substrate to forms part of or all of the passive component. A metal carrier may form part of the substrate and part of the at least one passive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.