Method for assembling a multiple layer electronic assembly
US9379469B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2014 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Jun 5, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Mechanisms for aligning electrical contacts of electronic components in a multiple layer electronic assembly are disclosed. A mounting plate is configured to align multiple layers of the multiple layer electronic assembly. The mounting plate includes a surface that a plurality of first anchor features at first predetermined locations of the surface configured to anchor a plurality of first layer electronic assemblies with respect to the surface. The mounting plate also includes a plurality of second anchor features at second predetermined locations configured to anchor at least one second layer electronic assembly with respect to the plurality of first layer electronic assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.