Radiation-emitting component

US9379517B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Andreas Wojcik · Solms, DE
• Josip Maric · Sinzing, DE
• Martin Haushalter · Regensburg, DE
• Frank Möllmer · Bad Abbach, DE

Key dates

• Filing date: Sep 27, 2012
• Grant date: Jun 28, 2016
• Expiry date: Sep 27, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/0428
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.