Manufacturing method of heat dissipation structure applied to mobile device
US9381717B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jan 22, 2014 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A manufacturing method of heat dissipation structure applied to mobile device. The heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.