System and method for thermal mitigation for tire pressure measurement electronics
US9381779B2 · kind B2 · utility
1Cited by
15References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2012 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Jun 8, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60C2200/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal pressure measurement assembly coupled to a rim of an aircraft wheel. A housing is configured to be fastened to a wheel face. An electronics enclosure is positioned in the housing. Electronics are positioned in the electronics enclosure and configured to process a signal received from a remote sensor that measures tire pressure and temperature. Internal insulation is positioned in an interior of the housing. The internal insulation is configured to reduce the temperature of the electronics sufficiently to permit use of low temperature electronics rated to 125 degrees C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.