Device and system detecting breakage in dummy bumps and method thereof
US9383401B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2012 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Oct 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
There is provided with an electronic device including: a main board, a plurality of electronic substrates, a first chain, a measuring unit and a controller, in which the plurality of electronic substrates each are mounted on the main board via solder joints, the first chain connects the solder joints in series throughout all of the electronic substrates, comprising a plurality of second chains each being a part of the first chain and connecting the solder joints in each corresponding one of the electronic substrates, the measuring unit measures an electrical resistance of the first chain and electrical resistances of the second chains, and the controller detects, if the electrical resistance of the first chain is equal to or higher than a first threshold value, the second chain having an electrical resistance equal to or higher than a corresponding second threshold value from among the second chains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.