Multi-dimensional artifact assemblage for infrastructure and other assets with interface node mediators
US9384308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2010 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Jun 12, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2219/004
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method to compile different types of data from different locations into one reliable assemblage is provided. The assemblage includes an index of information provided to a user. The assemblage may be in the form of a three dimensional (3D) representation of an object, where the 3D representation includes an index and links to more detailed information regarding the object. The 3D representation of any object, for example, a body part in the context of medical imaging, or a building in the context of architectural and engineering design. The assemblage is comprised of 3D and 2D artifacts. The 2D artifact includes 2D vector and raster embellishment in a variety of forms. The 3D artifact includes vector graphics (2D and 3D) including all data obtained through data conversion methods, and “Point clouds” (voxels).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.