Semiconductor manufacturing equipment with trace elements for improved defect tracing and methods of manufacture
US9385018B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2013 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Jun 22, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53022
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing equipment comprising trace elements and method of manufacture are disclosed. The semiconductor manufacturing equipment includes one or more components, wherein at least one component is made from an alloy comprising one or more materials and one or more rare earth elements (REEs). The alloy comprises predetermined quantities of the respective REEs. The method for manufacturing a component includes forming an alloy comprising at least one material and one or more selected rare earth elements (REEs) and building the component with the alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.