Patent · US Active

Method for producing a dopant profile

US9385263B2 · kind B2 · utility

0Cited by
9References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 3, 2009
Grant dateJul 5, 2016
Priority date
Expiry dateDec 8, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing a dopant profile is provided. The method includes starting from a surface of a wafer-shaped semiconductor component by introducing dopant atoms into the semiconductor component. The dopant-containing layer is produced on or in a region of the surface in order to produce a provisional first dopant profile and then a plurality of semiconductor components having a corresponding layer is subjected to heat treatment on top of one another in the form of a stack in order to produce a second dopant profile having a greater depth in comparison to the first dopant profile.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.