Method for producing a dopant profile
US9385263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2009 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Dec 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a dopant profile is provided. The method includes starting from a surface of a wafer-shaped semiconductor component by introducing dopant atoms into the semiconductor component. The dopant-containing layer is produced on or in a region of the surface in order to produce a provisional first dopant profile and then a plurality of semiconductor components having a corresponding layer is subjected to heat treatment on top of one another in the form of a stack in order to produce a second dopant profile having a greater depth in comparison to the first dopant profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.