Method for manufacturing composite piezoelectric substrate
US9385301B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2013 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | May 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a composite piezoelectric substrate capable of forming an ultra-thin piezoelectric film includes preparing a piezoelectric substrate and a supporting substrate, implanting ions from a surface of the piezoelectric substrate to form a defective layer in a region of the piezoelectric substrate, removing impurities that are adhered to at least one of the surface of the piezoelectric substrate in which the defective layer is formed and a surface of the supporting substrate to directly expose the constituent atoms of the surfaces and to activate the surfaces, bonding the supporting substrate to the surface of the piezoelectric substrate to form a bonded substrate body, and separating the bonded substrate body at the defective layer formed in the piezoelectric substrate so that a separation layer between the surface of the piezoelectric substrate and the defective layer is separated from the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.