Interposer and semiconductor module using the same
US9386685B2 · kind B2 · utility
11Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Oct 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources.An interposer 24 comprises a body having a cavity 23 maintained in vacuum; insulating layers 22a and 22b formed respectively on upper and lower walls 20a and 20b of the body; and heat reflecting layers 21a and 21b formed respectively on the insulating layers 22a and 22b. The interposer 24 thermally insulates semiconductor devices 11a and 21a mounted respectively on upper and lower sides of the interposer 24.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.