Module, module combined body and module production method
US9386698B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2013 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Oct 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module comprises a first insulating-substrate-side member that has a first insulating substrate, a first conductor layer provided on the first insulating substrate, and a first electronic element provided on the first conductor layer; a second insulating-substrate-side member that has a second insulating substrate, a second conductor layer provided on a lower side of the second insulating substrate, and a second electronic element provided on a lower side of the second conductor layer; and a sealing member that is provided between the first insulating substrate and the second insulating substrate. The first electronic element and the second electronic element are opposingly disposed. The first electronic element and the second electronic element are connected by an element connecting conductor post that has electric conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.