Heat transfer structure
US9389029B2 · kind B2 · utility
5Cited by
89References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2013 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Apr 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.