Chip-scale interferometry for hyperentanglement processing

US9389063B2 · kind B2 · utility

Assignee

• The Trustees of Columbia University in the City of New York · US

Inventors

• Chee Wei Wong · New York, US
• Franco N. C. Wong · Lexington, US
• Dirk Robert Englund · San Diego, US

Key dates

• Filing date: Apr 4, 2014
• Grant date: Jul 12, 2016
• Expiry date: Apr 4, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An interferometer module for quantum processing is described including a substrate having two or more input ports and two or more output ports; multiple photonic pathways embedded in the substrate for conveying photons from the two or more input ports and the two or more output ports; and one or more partial beam splitters embedded in the substrate in a photonic pathway for generating spatial and polarization entanglement.