Distributed sensor grid, surface, and skin systems and methods
US9389105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2013 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jun 4, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides distributed sensor grid, surface, and skin systems and methods that utilize compressive sampling systems and methods for reading and processing the outputs of sensor arrays (serial and/or parallel) such that increased speed can be achieved. These sensor arrays can be functionalized or sensitized in any desired manner and functions are derived from the outputs, as opposed to individual data points. The sensor arrays can be made in the form of a textile, a fiber optic network, a MEMS network, or a CMOS camera, for example. In general, in accordance with the systems and methods of the present disclosure, a Code is applied to a distributed sensor as part of the compressive sampling technique and derives the functions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.