Interconnect bridge assembly for photonic integrated circuits

US9389441B2 · kind B2 · utility

Assignee

• Infinera Corp. · US

Inventors

• David Coult · Oley, US
• Radhakrishnan L. Nagarajan · Santa Clara, US
• Jiaming Zhang · New York, US
• Joseph Edward Riska · Macungie, US
• Donald J. Pavinski · Alburtis, US
• Jie Tang · Ibaraki, JP
• Timothy Butrie · Lower Saucon Township, US

Key dates

• Filing date: Apr 2, 2013
• Grant date: Jul 12, 2016
• Expiry date: Apr 2, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4274
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.