Air-flow-by cooling technology and air-flow-by circuit board modules
US9389654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2013 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Apr 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.